Web13 Jan 2024 · After the vacuum chamber was pumped to a base pressure of 2.0 × 10 −3 Pa, the target was cleaned by DC magnetron sputtering (DCMS, 2 A) for 10 min, and the substrate was cleaned by glow discharge with Ar ions (3.6 Pa; applied DC bias voltage, −1500 V) for 25 min. The Ti film was then deposited by DCMS (3 A) with a DC substrate … WebPurity: 99.99%, Size: 1'', Thickness: 0.125''. Sputtering is a proven technology capable of depositing thin films from a wide variety of materials on to diverse substrate shapes and …

Sputtering Targets Thin Films - Admat Inc

WebSputtering occurs when the erosion process takes place in conditions of glow discharge between an anode and a cathode. In this way, and by careful selection of the ionization … Web1 day ago · Regarding the target voltage, the sputtering mode is metallic (MM) when R N varies between 0 and 2 %, but as the nitrogen flow increases the target starts to be poisoned. The target voltage increases ( Fig. 1 a) which could be related to both, surface condition that could get poisoned by implantation of reactive gas species during reactive … the hamilton method of apportionment

Sputtering Targets AMERICAN ELEMENTS

WebIt is better to use a thickness monitor to measure the actual deposited coating thickness. Note: Sputter rate is measure of the amount of material removed from the target. … Web8 Dec 2013 · Metallicsilver (99.9% pure) of 50 mm diameter and 3 mm thickness was used as sputter target. The base pressure of 5 × 10 −4 Pa was achieved in the sputter chamber using diffusion pump and rotary pump combination. Argon was used as the sputter gas and oxygen as reactive gas. WebThe sputtering “Yield” calculation data in the third column represents the number of target atoms sputtered (ejected from the target) per argon ion striking the target with a kinetic … the bathla group